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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

Name: Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVAJF108
Brand: WANLI-ADHESION
Price: 1 USD

Buy cheap Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 product

Brand Name : WANLI-ADHESION

Model Number : EVA-JF-108

Certification : ISO9001 ISO14001 IATF16949

Place of Origin : CHINA

MOQ : 25 KG

Payment Terms : L/C, T/T

Delivery Time : 5-8 work days

Packaging Details : 25Kg/Bag

Product : EVA Hot Melt Adhesive

Component : EVA

Appearance : White Solid Particles

Solid Content : 100 Percent

Shelf Life : 2 * Years

Melt Viscosity : 70000±10000mpa·s (200℃)

Softening Temperature : 95℃~105℃

Operating Temperature : 180℃～200℃

Usage Scope : Edge Bonding of Wood Materials- Chip Board

Application Industry : Woodworking Edgebanding

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Hot Sale Factory Direct 100% Solid White Round Particles EVA Hot Melt Adhesive WANLI® EVA-JF-108 for Edge Bonding with High Bonding Strength

Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various kinds of edge band. It is featured high bonding strength, lower cost and fast curing.

APPLICATION

Wanli® EVA hot melt adhesive JF-108 is used for bonding of chip board to various kinds of edge band.

Application Material	Woodworking Edgebanding Hot Melt Adhesives
Appearance	White Solid Particles
Component	EVA
Application Industry	Woodworking Edgebanding
Solid Content	100%
Operating Temperature	180℃～200℃( Depend On Machine, Substrate, Environment And Other Conditions).
Softening Temperature	95℃~105℃
Melt Viscosity	70000±10000mpa·s (200℃)
Curing	Normal Temperature Curing
Usage Scope	Edge Bonding of Wood Materials- Chip Board
Shelf Life	2 * Years
Package	25Kg/Bag

FEATURE

High bonding strength, lower cost and fast curing

USER GUIDE

The package of JF-108 is suitable for various dispensing equipment. The recommended operating temperature is 180℃~200℃, which depends on the equipment, substrate and environment and other conditions.

STORAGE

Store indoors and do not expose to extreme weather conditions (e.g. rain or exposure to sunlight). The storage temperature should be no more than 35℃ and avoid open fire or heat source.

Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

fast curing Hot Melt Adhesive

White particles Hot Melt Adhesive

Hot Melt Adhesive High bonding strength

Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 Images